High-performance N-channel, P-channel, and Dual complementary MOSFETs designed to minimize conduction loss and optimize thermal management in lithium-ion protection circuits.
Understanding the macro shift in energy transition, manufacturing capacities, and technical parameters expected by modern supply chains.
Battery protection circuit modules (PCMs) and Battery Management Systems (BMS) are vital for safeguarding Lithium-ion, LiFePO4, and Sodium-ion battery packs from overcharge, over-discharge, over-current, and short-circuit conditions. At the heart of these safety circuits lies the Power MOSFET. Serving as the primary solid-state switch, the selection of the MOSFET determines the efficiency, safety, and lifespan of the battery pack.
In high-current battery configurations (such as electric vehicles, energy storage systems, and power tools), conduction losses dominated by I²R calculations can lead to extreme heat generation. Selecting MOSFETs with sub-milliohm RDS(on) (such as the WSK280N06G6 with N-channel 60V 280A inside a TO-263-2L package) ensures minimal heat dissipation, eliminating the need for expensive, bulky external heatsinks.
During a short-circuit fault, the protection system must isolate the cells within microseconds to prevent runaway conditions. Lower gate charge (Qg) allows the BMS driver circuit to rapidly charge or discharge the gate terminal, guaranteeing fast transition speeds. Our DFN5X6-8 packaged N-channel solutions offer an optimized balance of low gate charge and high avalanche ruggedness.
For compact portable consumer electronics like smartphones and wearable smart home hubs, space saving is paramount. Integrating N+P-channel MOSFET pairs (such as the WSP4608 or WSP4067 in SOP-8 packages) allows manufacturers to consolidate the charge and discharge paths into a single footprint, lowering Bill of Materials (BOM) complexity and overall PCB manufacturing costs.
Furthermore, modern BMS designs face unique challenges under surge current conditions. High transient voltage spikes (VDS) generated during inductive load turn-off can exceed the absolute maximum ratings of standard switches. Incorporating robust avalanche-rated (EAS) MOSFETs from the WINSOK product range mitigates these risks, delivering outstanding resilience against electrical overstress (EOS) in industrial applications.
HONGKONG Olukey INDUSTRY CO., LIMITED is a leading solution provider focusing on the overall integration of high-reliability electronic product components. Our product portfolio is strategically divided into three key vertical product lines: WINSOK MOSFET, Cmsemicon MCU, and comprehensive PCBA circuit board solution development.
At present, Olukey Industry's advanced semiconductor solutions are extensively deployed in automotive electronics, military electronics, smart industrial control systems, new energy storage solutions, smart medical devices, 5G infrastructure, Internet of Things (IoT) sensors, smart home ecosystems, and high-performance consumer electronics. Relying on key structural relationships as the global general agent of premier original fabrication plants, we focus heavily on supporting the Asia-Pacific market while providing local distribution and technical support globally.
We combine extensive packaging diversity, global distribution capability, and rich microcontroller integration to provide premium OEM/ODM component sourcing.
Through robust ties with leading silicon wafer fabs and advanced testing facilities in the Asia-Pacific, Olukey provides a secure supply chain with minimal lead times. This direct integration guarantees 100% original, traceably manufactured parts.
The WINSOK MOSFET line covers a broad spectrum of low-to-medium voltages: 15V, 20V, 30V, 40V, 60V, 80V, 100V, 120V, 150V, 200V, 250V, 300V, 400V, 500V, 600V, and 650V. Backed by 600+ active device models in SOP-8, SOT-23, DFN3X3-8, DFN5X6-8, TO-252, TO-263, and TO-220 packages.
As a global partner of Cmsemicon MCU, we assist our engineering clients in integrating microcontrollers with our MOSFET switches to build unified, intelligent charging boards, logic control modules, and smart power units.
We use our comprehensive high-quality services to provide customers with various types of advanced high-tech electronic components, assist manufacturers in producing high-quality products and provide comprehensive services. Over the years, the company has relied on reputation to survive, adhering to the tenet of "quality first, service first", and has established good cooperative relationships with many high-tech enterprises and original manufacturers at home and abroad.
Becoming a global high-value agent is the common goal pursued by OLUKEY Industrial employees. We adhere to the corporate values of "Pragmatism, Win-win, Service and Responsibility", continue to strengthen service quality, and aim to provide high-quality services. We work hand in hand with suppliers to jointly explore a larger market and contribute to the prosperity and development of semiconductors.
A visual look into our supply capabilities, quality control processes, and original component packaging arrays.
Our MOSFETs are engineered to address the specific performance thresholds of different target industries.
Designed to comply with high thermal stresses and vibration environments. Used in Auxiliary Power Units, battery cell monitoring, and active balancing circuitry. Our N-channel 60V and 80V parts offer high avalanche tolerances necessary for automotive functional safety designs.
For heavy-duty battery packs used in grid storage, solar backup, and industrial forklifts. High-current packages like TO-263-2L and TO-220 provide the thermal performance and current density needed for power modules up to 200A+ continuous current rating.
For smartphones, smartwatches, IoT nodes, and smart home appliances, where battery life and space are premium. Low RDS(on) P-channel and Dual N+P complementary MOSFETs in ultra-compact DFN3X3-8 and SOT-23 packages ensure minimal standby battery leakage.
To support next-generation battery management systems, OLUKEY Industry and WINSOK MOSFET maintain a rigorous technological development pipeline focused on efficiency, thermal reduction, and intelligent co-packaging.
Refining cell density in trench MOSFET structures to achieve RDS(on) values under 1.2mΩ in standard DFN5X6-8 profiles, aiming to reduce static conduction losses by up to 20% in high-power battery packs.
Implementing integrated Zener diodes between the gate and source terminals inside ultra-small packages (such as SOT-523-3L and DFN2X2) to shield fragile gate oxides from electrostatic discharges (ESD) during assembly.
Developing multi-chip modules (MCMs) that co-package N-channel drivers and advanced microcontrollers, reducing overall component size on BMS boards and offering real-time programmable current cut-off thresholds.
Expert engineering answers addressing design concerns, sourcing requirements, and standard compliance questions.
Additional packaging configurations, high-voltage options, and dual-channel options designed for specialized industrial power designs.
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