Explore our in-stock, factory-direct silicon power devices engineered for maximum thermal capability and low Rds(on).
The global shift toward electric vehicles (EVs) demands unprecedented levels of efficiency, power density, and thermal management in power electronics systems. At the heart of this electric revolution lies the On-Board Charger (OBC), an essential subsystem tasked with converting AC grid power into high-voltage DC to charge the vehicle's battery. Achieving maximum conversion efficiency requires silicon power switches with optimized dynamic performance and low conduction losses.
HONGKONG Olukey INDUSTRY CO., LIMITED, a leading electronics solution provider, addresses this industry imperative. By distributing premium WINSOK MOSFETs and co-developing turnkey PCBA solutions with integrated Cmsemicon MCUs, we offer tier-one automotive manufacturers and OBC design houses the components needed to scale production with minimal time-to-market. Our massive inventory buffer and robust design capabilities (ODM/OEM) ensure that the global automotive supply chain remains unbroken.
Key Design Constraint: Modern OBCs require power components to survive harsh operating conditions including high ambient temperatures, thermal cycling, and high EMI noise levels. WINSOK's range of 15V to 650V MOSFETs are architected specifically to overcome these challenges.
Our engineering and manufacturing ecosystem delivers reliable semiconductor solutions at global scale.
Understanding where our MOSFETs fit and add value in the electrical layout of an On-Board Charger.
The PFC stage shapes the input current to match the sinusoidal mains voltage, maintaining a high power factor and minimizing harmonic distortion. In high-power 3.3kW to 22kW OBC designs, silicon MOSFETs with low gate charge (Qg) and fast switching speeds are critical to keeping power losses low in boost converter or interleaved PFC configurations. Our 600V and 650V Superjunction devices (e.g. WSK45N65 in TO-263-2L packages) are ideally suited here.
The LLC stage provides galvanic isolation and steps the voltage up or down to the target battery range. Operating under Zero Voltage Switching (ZVS) or Zero Current Switching (ZCS), this stage significantly reduces switching losses. WINSOK's high-voltage N-channel MOSFETs deliver low output capacitance (Coss) to ensure swift resonant transitions, while the robust body diode resists dv/dt stress during hard commutation phases, maximizing system reliability.
On the secondary output side of the OBC, active switches replace traditional diodes to rectificate the high frequency AC voltage into clean DC power for the EV battery. Because this output stage deals with high currents, reducing conduction loss is paramount. Using medium-voltage (60V, 80V, 100V) MOSFETs featuring ultra-low Rds(on) (such as the DFN5X6-8 packaged N-channel switches) prevents excessive heat generation, improving overall OBC efficiency.
A technical breakdown of packaging and voltage ratings configured for direct factory ODM supply.
| Package Configurations | Voltage Ranges Available | Target OBC Topology Function | Key Optimization Parameter |
|---|---|---|---|
| DFN5X6-8, DFN3X3-8, DFN2X5-6S | 15V, 20V, 30V, 40V | Auxiliary Power Supply, Low-voltage Buck Converters, MCU power rails | Footprint reduction, Low gate charge (Qg), Low input capacitance |
| SOP-8, SOT-23-3L/6L | 60V, 80V, 100V, 120V | Control logic switches, Signal isolation, Gate driver circuits | Extremely low threshold voltage, Fast turn-on, Space efficiency |
| TO-220-3L, TO-252, TO-263-2L | 150V, 200V, 250V, 300V | Low-power auxiliary DC-DC converters, BMS safety relays | Rugged avalanche rating (EAS), High thermal dissipation (RthJC) |
| TO-263, TO-220, Advanced DFN | 400V, 500V, 600V, 650V | Primary side PFC, Active-clamp flyback, LLC resonant switch network | Superjunction structure, Ultra-low FOM (Rds(on) x Qg), Fast body diode recovery |
Did you know? HONGKONG Olukey INDUSTRY CO., LIMITED is a multi-dimensional solution provider. Beyond WINSOK MOSFETs, we offer Cmsemicon MCU system architectures and turn-key PCBA development, solving high-voltage isolation, sensing, and system-level firmware control under one roof.
Sourcing semiconductor devices globally requires a balance of high-volume capacity, competitive costing, and bulletproof logistical infrastructure. Our factories and distribution networks located within the Shenzhen-Hong Kong semiconductor hub present significant advantages to international OEMs and Tier-1 automotive firms:
How we guarantee localized operations support and rigorous automotive and electrical compliance globally.
To withstand the rigorous thermal demands of on-board automotive sub-assemblies, our design procedures align with the international AEC-Q101 standard. Devices undergo high-temperature reverse bias (HTRB), high-temperature gate bias (HTGB), and temperature cycling (-55°C to 150°C) tests to assure near-zero defect rates throughout the vehicle’s lifetime.
All component series exported comply with RoHS (Restriction of Hazardous Substances) and REACH directives, ensuring easy import and regulatory clearance in the EU, North America, and other highly regulated global regions. We handle full custom documentation and export licensing directly from our Hong Kong operations center.
Our localized support network stretches across key industrial clusters. Olukey provides dedicated Field Application Engineers (FAE) who can assist your design teams with MOSFET selection, thermal simulation modeling, gate resistor tuning to suppress ringing, and EMI compliance debugging directly at your lab bench.
Stay ahead of the market curves by aligning your component procurement with industry shifts.
Vehicle-to-Grid (V2G) and Vehicle-to-Home (V2H) technologies are rapidly shifting from premium configurations to standard expectations. This shift requires bidirectional OBC topologies, meaning the secondary rectifier circuit must also operate as an inverter. High-efficiency MOSFETs with low body diode recovery time (Trr) and low reverse recovery charge (Qrr) are essential to prevent cross-conduction issues during bidirectional power flow. WINSOK's high-speed body diode options fit perfectly into these bidirectional H-bridge stages.
To support ultra-fast charging, passenger car EV batteries are shifting from 400V to 800V. While 800V battery architectures encourage the integration of wide-bandgap SiC (Silicon Carbide) power devices, premium Silicon MOSFETs remain the design-of-choice for 400V platforms and auxiliary DC-DC systems due to mature manufacturing yields and superior cost-performance ratios. Combining high-voltage silicon switches with Olukey's specialized controller architectures ensures maximum system efficiency without incurring the cost penalties of pure SiC layouts.
Our solutions are deployed across diverse operating environments and configurations.
Optimized for smart residential chargers where thermal limits are capped by static wall-mount environments. Our low thermal resistance (Rth) packages ensure heat is transferred effectively into the enclosure structure, omitting the need for expensive cooling fans.
Designed for multi-shift transport hubs. These applications call for continuous maximum-power operation under elevated temperatures. The high avalanche capability (UIS rating) of our medium and high-voltage MOSFETs prevents failure during input grid transients.
Feeding the dashboard, sensors, infotainment systems, and electronic braking. WINSOK’s dual N+P channel DFN5X6-8L and DFN3X3-8L packages optimize PCB layout complexity and component counts in these dense auxiliary designs.
We are a customer-oriented global solution provider focusing on the overall integration of electronic product components. Our three core product pillars include: WINSOK MOSFETs, Cmsemicon MCUs, and end-to-end PCBA circuit board development.
Currently, our solutions are widely utilized in automotive electronics, industrial automation systems, military electronics, smart medical hardware, 5G base stations, the Internet of Things (IoT), smart home devices, and consumer electronics. By leveraging global direct sourcing relationships with primary chip wafer factories, we provide advanced semiconductors across the Asia-Pacific and Western markets. Our core operations model relies on reputation to survive, maintaining the standard of "quality first, service first." We collaborate with global suppliers to extend product life cycles, guarantee continuous production runs, and secure your component supplies.
Our competitive advantage lies in structural optimization across design, sourcing, and logistics. By replacing sole-sourced, high-premium parts with high-performing, pin-to-pin compatible WINSOK devices, customers achieve cost reductions without design re-spins.
Get instant answers to technical questions, ordering processes, and customization options.
WINSOK MOSFETs are engineered to be high-quality, pin-to-pin functional replacements for standard market offerings. Our devices feature similar electrical parameters, including low RDS(on), gate charge, and thermal profiles. By matching footprints (like DFN5x6, TO-252, TO-263), clients can directly drop WINSOK parts into existing designs to secure better pricing and lead times without requiring structural layout redesigns.
Yes. We offer specific automotive product line options qualified to AEC-Q101 standards, which guarantee the thermal cycling, bias safety, and mechanical ruggedness required to withstand internal combustion engine compartment and electric drive-train environments. For high-volume automotive projects, please contact our FAE team to obtain the PPAP documentation.
We provide full design customization. Our engineers can modify electrical performance targets (such as specific gate threshold values), optimize lead frame structures for enhanced heat dissipation, or design a complete PCBA solution combining our microcontrollers (Cmsemicon MCUs) with power MOSFET drivers. This co-design significantly reduces development risk and ensures seamless subsystem communications.
We maintain a massive rolling inventory of popular WINSOK power MOSFETs and Cmsemicon MCUs in our Hong Kong and Shenzhen hubs, enabling immediate shipping. For custom fabrication or larger volumes exceeding buffer stocks, standard lead times vary from 6 to 10 weeks, significantly faster than typical global semiconductor lead times.
Yes, we provide free engineering samples for qualifying industrial and automotive development projects. Our technical support engineers also offer layout reviews, gate driver configuration advice, and thermal simulation validation to guarantee successful laboratory testing.
Further inventory components, dual-channel devices, and microcontrollers ready for rapid deployment.
Partner with HONGKONG Olukey INDUSTRY CO., LIMITED for optimized power MOSFET solutions. Whether you need in-stock deliveries, ODM customization, or comprehensive PCBA design integration, we possess the manufacturing capabilities to ensure your project's success.
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