Explore our high-performance power semiconductors optimized for high-power density, thermal resilience, and fast switching frequencies in electric vehicle applications.
HONGKONG Olukey INDUSTRY CO., LIMITED is a pioneer solution provider focusing on the overall solution of high-performance electronic components. We design, manufacture, and distribute across three primary product lines: WINSOK MOSFETs, Cmsemicon MCUs, and customized PCBA circuit board solution development.
At present, the products of Olukey Industry are widely integrated into safety-critical and highly demanded systems within automotive electronics, military electronics, smart industry, new energy vehicles (NEVs), smart medical care, 5G infrastructures, Internet of Things (IoT), smart home applications, and general consumer electronic products.
Leveraging direct alliances with global general agents of major original fabrication facilities, we serve the comprehensive demands of the Asia-Pacific market. We provide global system developers with high-reliability, advanced electronic components. Our end-to-end service model ensures robust supply stability, helping downstream manufacturers realize superior product performance, high safety compliance, and maximum cost efficiency.
As electric vehicles pivot to higher battery voltages and strict efficiency parameters, the power semiconductor landscape is evolving. Our engineers optimize the threshold voltage, RDS(on), and gate charge coefficients to push the boundaries of conventional silicon and prepare for upcoming wide-bandgap matrices.
By implementing proprietary Shielded Gate Trench (SGT) geometry in our medium and low voltage (30V–150V) product portfolios, Olukey drastically reduces specific on-resistance ($R_{DS(on) \cdot A}$). The SGT structure introduces a shielding electrode to reduce the gate-to-drain capacitance ($C_{gd}$), resulting in a lower Gate Charge ($Q_g$) profile. This directly translates to minimized switching losses during high-frequency DC-DC conversions within the EV powertrain.
High currents (up to 220A in products like WSD220N06DN56) present critical thermal challenges. Our DFN5x6-8L and DFN3x3-8L packages implement dual-sided cooling configurations and copper-clip bonding structures. This removes internal wire bonds, lowering package resistance while dropping junction-to-case thermal resistance ($R_{\theta JC}$) below 0.5°C/W.
Automotive transients and motor back-EMF spikes demand high Avalanche Energy ($E_{AS}$) ratings. Olukey's WINSOK MOSFETs undergo 100% Single Pulse Unclamped Inductive Switching (UIS) testing. This ensures that in situations like emergency motor shutdown or sudden relay disconnection, our devices safely absorb transient currents without catastrophic breakdown.
We rely on the advantages of global general agents of major original manufacturers, based on the Asia-Pacific market. Through active market development and effective resource integration, we have grown into a premier distribution partner.
WINSOK MOSFET's product voltages are mainly medium and low voltage: 15V, 20V, 30V, 40V, 60V, 80V, 100V, 120V, 150V, 200V, 250V, 300V, 400V, 500V, 600V, 650V. This provides full coverage of the primary voltage bands required by electric vehicle auxiliary systems and industrial automation.
We supply more than 600 models and over 40 packages including DFN3X3-8, DFN5X6-8, TO-252, TO-263, SOP-8, SOT-23, TO-220, and more. This layout covers the vast majority of standard discrete and surface-mount power footprints in the electronics industry.
In addition to power switches, we offer Cmsemicon MCUs—a microcontroller portfolio born in Shenzhen, featuring rich product variety and robust technical research—and customized PCBA development. This allows us to supply complete system solutions under one procurement roof.
Over the years, Olukey has relied on reputation to survive, adhering to the core principle of "quality first, service first." We have established strong cooperative relationships with many high-tech enterprises and original component manufacturers at home and abroad. As we expand, our goal remains clear: to build global service capacity, reinforce quality control, and work alongside customers and suppliers to drive semiconductor development.
During cell balancing and switch protection, low $R_{DS(on)}$ MOSFETs prevent excessive self-heating in tight enclosures. High-cell count BMS boards utilize our 80V and 100V DFN packages to ensure rapid safety cuts and low leakage currents.
Electric steering (EPS), coolant pumps, and HVAC compressor drives run on high-frequency inverters. Our DFN5X6-8L MOSFETs (e.g. 60V 220A) handle start-up transient currents while keeping electromagnetic interference (EMI) low.
Converting high battery pack voltages (up to 400V/800V) to low-voltage 12V/48V nets requires high switching speeds. Our low gate charge ($Q_g$) MOSFETs enable higher frequency switching, shrinking passive filters.
On-board chargers (OBC) and DC fast-charging stations leverage our 600V and 650V planar and superjunction MOSFET topologies (such as the WSR20N65F) to handle power-factor correction (PFC) cycles and LLC converter sections.
Olukey's manufacturing infrastructure utilizes high-throughput Industry 4.0 automation. By integrating smart sensor technologies at every point of the packaging and testing process, our partner foundries maintain a high yield rate and stable production output.
Our supply model centers on a highly responsive raw materials sourcing network. With guaranteed wafer allocations and multi-fab fallback strategies, we mitigate macro supply chain volatility. For tier-1 automotive suppliers, this translates to stable pricing and reliable delivery schedules during peak production cycles.
Each batch of automotive-intended discrete components is subjected to strict verification:
Faced with long lead times or high prices from legacy tier-1 chipmakers, global component buyers require high-pin compatibility replacements. Olukey supports cross-referencing for brands like PANJIT, NIKO-SEM, POTENS, and others. We provide drop-in replacements that require minimal PCB re-layout work.
All our manufacturing and packaging processes adhere to international standards. Our products carry full RoHS and REACH certifications. We manage regulatory documentation, trace reports, conflict-free mineral declarations, and quality certifications to ensure clean audits for your end-system.
Whether you require specialized gate oxide thicknesses, adjusted source-drain lead geometries for specialized high-vibration automotive housings, or custom marking, our OEM/ODM custom package programs deliver to your design standards.
Our engineering team analyzes package footprints, thermal pad layouts, and key electrical specifications such as threshold voltage ($V_{GS(th)}$), gate charge ($Q_g$), internal capacitance profiles ($C_{iss}$/$C_{oss}$), and maximum continuous drain current ($I_D$). In many cases, we offer drop-in replacements for standard packages like DFN5x6, DFN3x3, TO-252, and TO-263, saving you from redesigning your PCBs.
Conduction loss is determined by $I^2 \cdot R_{DS(on)}$. In high-power designs like EV drive controls and high-current battery disconnect circuits, currents easily exceed 100A. A tiny reduction in $R_{DS(on)}$ dramatically reduces thermal output. This lowers cooling demands, allows for smaller heatsinks, and improves vehicle range.
Our automotive-targeted components are characterized and tested under conditions based on AEC-Q101 requirements. This includes High Temperature Reverse Bias (HTRB) to test long-term gate reliability under bias, High Temperature Gate Bias (HTGB), and thermal cycle tests. We also perform 100% Unclamped Inductive Switching (UIS) testing to ensure ruggedness under avalanche conditions.
Standard inventory parts can be shipped immediately from our warehouse facilities. For high-volume factory orders or custom packaging requests, lead times range from 4 to 8 weeks depending on packaging line availability and wafer fabrication schedules. We offer tailored stocking arrangements for long-term production contracts.
Review our second set of high-efficiency products, including specialized packages and high-density footprints.
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