Explore our premium selection of low and medium voltage MOSFET devices, optimized for switching losses, gate charge, and thermal dissipation in automotive and safety-critical subsystems.
HONGKONG Olukey INDUSTRY CO., LIMITED stands at the forefront of power semiconductor distribution and integration. As an elite, global solution provider, we concentrate on delivering all-encompassing, high-reliability electronic product component architectures. Our specialized engineering capabilities are divided into three highly synergies product lines: WINSOK MOSFETs, Cmsemicon MCUs, and bespoke PCBA circuit board solutions.
By positioning our distribution and design services within the heart of the Asia-Pacific technology hub, Olukey Industry serves as a bridge between Tier-1 original equipment manufacturers (OEMs) and advanced manufacturing foundries. We leverage direct factory relationships to provide comprehensive services that support mission-critical designs globally.
Modern Advanced Driver Assistance Systems (ADAS)—ranging from Lidar scanning units and high-resolution radar sensors to localized vision domain processing units—require robust and highly efficient power delivery networks. MOSFETs used in these scenarios must meet strict automotive requirements: low static resistance ($R_{DS(on)}$), high speed, low thermal stress, and compact packages.
Reduces conduction losses during heavy loading in ADAS compute platforms, preventing thermal runaway and minimizing localized board heating.
Protects the system against high voltage spikes and switching transients commonly found in noisy automotive electrical environments.
Designed in space-saving DFN3x3 and DFN5x6 configurations with exposed thermal pads, optimizing heat transfer to internal PCB ground planes.
Choosing the right partner for ADAS power semiconductor procurement requires balancing strict design rules with global supply chain efficiency. Olukey Industry leverages the distribution networks of major global semiconductor factories to provide a reliable supply of WINSOK MOSFETs and Cmsemicon MCUs across the Asia-Pacific region and beyond.
Through close coordination with local agents and directly with original chip manufacturers, we ensure that every client receives authentic products with fully traceable manufacturing histories. This eliminates the risk of counterfeit components, which can be critical for safety-oriented ADAS architectures.
Our product portfolio ranges from 15V, 20V, 30V, 40V, 60V, 80V, 100V, 120V, 150V, 200V, 250V, 300V, 400V, 500V, 600V, to 650V. Combined with over 40 distinct package configurations—including advanced DFN3X3-8, DFN5X6-8, TO-252, TO-263, SOP-8, SOT-23, and TO-220—we cover a wide range of medium and low voltage silicon designs on the market.
This wide selection makes it easier to find drop-in replacements and alternative options. It allows engineers to replace hard-to-source parts from Tier-1 brands with high-performance, cost-effective alternatives from a single supplier.
Cross-referencing power components in functional safety systems like ADAS requires checking parameters beyond simple pin-to-pin footprint matching. To ensure reliability, engineers must review and match several key parameters:
| Parameter | Critical Assessment Rule | Impact on ADAS Functionality |
|---|---|---|
| Drain-Source Breakdown ($V_{DSS}$) | Must match or exceed the target OEM specification. A minimum safety margin of 20% over worst-case input voltage transients is recommended. | Prevents avalanche breakdown during power transients in the automotive power network. |
| Static Drain-Source On-State Resistance ($R_{DS(on)}$) | Should be equal to or lower than the original component at the designated Gate-Source Drive Voltage ($V_{GS}$). | Reduces static conduction losses, helping to keep module operating temperatures lower. |
| Total Gate Charge ($Q_g$) | Must match the drive capability of the existing gate driver IC. Avoid excessive deviations. | Directly affects switching times and driver power consumption. Too high a charge can cause driver overload or slower switching. |
| Thermal Resistance ($R_{\theta JC}$) | Ensure junction-to-case resistance matches or is lower than the target part to support efficient heat transfer. | Influences overall thermal design and cooling requirements in enclosed, fanless ECU modules. |
By utilizing WINSOK's comprehensive component mapping, Olukey provides verified drop-in alternatives for standard market parts. This includes replacements for products from Infineon (OptiMOS series), ON Semiconductor (PowerTrench series), and Alpha & Omega Semiconductor (AON series), helping to secure your supply chain.
Olukey Industry optimizes operations through direct integration with automated manufacturing centers in Shenzhen and Hong Kong. Our manufacturing partners use advanced assembly machinery, real-time AOI inspection, and 3D CT scanning to ensure each component meets high automotive and industrial standards.
This localized manufacturing base allows us to offer shorter lead times and more flexible supply paths compared to traditional semiconductor supply routes. This helps our clients maintain production schedules and manage supply fluctuations, supporting production lines in automotive and industrial markets globally.
Navigating regional compliance and global supply regulations is critical for international electronics manufacturers. Olukey manages compliance throughout the product lifecycle to keep your designs aligned with global requirements.
Every component batch complies with RoHS, REACH, and other environmental regulations. Product design options also align with ISO 26262 functional safety standards where required.
We provide localized technical assistance through our engineering and service centers in the Asia-Pacific region, helping you with design-in challenges, simulation models, and compliance documentation.
Olukey manages end-to-end component tracking, verifying lot numbers, production dates, and QA reports from wafer foundry to final delivery.
Olukey uses a comprehensive validation workflow to ensure that the WINSOK MOSFETs and Cmsemicon MCUs we supply meet high standards of reliability. Every batch undergoes strict incoming quality control (IQC) checks, high-temperature testing, and packaging audits to verify parameters before shipment.
This thorough screening process is designed to prevent assembly line defects and field failures, helping our customers maintain high production yields and reliable product performance.
Our strong supplier relationships enable us to secure stable allocations even during high-demand periods. In addition, our experienced FAE (Field Application Engineering) team is ready to assist you in designing optimized circuits, finding suitable drop-in replacements, and managing component end-of-life (EOL) transitions.
Our focus on reliability, clear communication, and customer support has made Olukey Industry a trusted semiconductor partner for a variety of electronics companies around the world.
As automotive power networks transition from 12V to 48V architectures, and EV drivetrains move toward higher voltages, the requirements for power semiconductor devices are shifting. Olukey works continuously with partners to prepare our product offerings for these changes.
Transitioning from traditional wire-bonding to copper clip technologies in DFN packages. This transition helps reduce internal package resistance and inductance, lowering switching losses.
Expanding our selection of 80V and 100V MOSFETs. These devices are optimized for low gate charge ($Q_g$) to match high-frequency DC-DC converters in mild-hybrid vehicles.
Co-developing integrated smart power modules (IPMs) that bundle MOSFET switches and gate drivers into single-package solutions, simplifying layout designs.
Through our established logistics network in Hong Kong and Shenzhen, we maintain inventory levels across our key product lines. This warehousing footprint enables us to manage fluctuations in lead times and provide reliable delivery support to electronics assembly lines worldwide.
Whether you require standard packaging reels or specialized logistics handling, Olukey provides distribution services designed to keep your manufacturing schedules on track.
Explore answers to common questions about ADAS MOSFET specifications, cross-referencing procedures, and order fulfillment.
When replacing a MOSFET, check the breakdown voltage ($V_{DSS}$), current rating ($I_D$), and on-resistance ($R_{DS(on)}$) at your specific gate-source voltage. It is also important to match or lower the total gate charge ($Q_g$) to ensure compatibility with your existing gate driver, and verify that the physical package footprint matches exactly for proper thermal dissipation.
Yes. All WINSOK MOSFETs and related power products supplied by Hongkong Olukey Industry are fully compliant with RoHS and REACH regulations, meeting the environmental and materials safety requirements of global markets.
DFN packages (such as DFN3x3-8 and DFN5x6-8) feature an exposed bottom thermal pad. This design provides much lower thermal resistance ($R_{\theta JC}$) compared to leaded packages like SOP-8, helping to dissipate heat more efficiently in space-constrained ADAS modules.
Lead times depend on the specific part and order volume. For stocked items in our Shenzhen or Hong Kong warehouses, shipment can typically be arranged within 3–5 business days. For factory orders, lead times generally range from 4 to 8 weeks, which is often shorter than standard industry averages.
Submit your current component part numbers today. Our engineering team will review your requirements and provide verified cross-reference recommendations, pricing, and sample availability.
Contact Our Engineering TeamExplore more active components in our portfolio, including dual-channel MOSFET configurations, integrated wireless charging systems, and Cmsemicon MCUs.
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